10-Layer HDI Tg180 FR-4 PCB for High Performance
1.Overview of PCB Specifications
| Specification | Details |
|---|---|
| Board Type | 10 layers, N+4+N HDI PCB |
| Material | FR-4 ITEQ IT-180A |
| Solder Mask | Green on both sides |
| Silkscreen Print | White on both sides |
| Surface Finish | ENIG |
| Total Thickness | 1.6mm ± 10% |
| Board Size | 269mm x 213mm (1 PCS) |
| Minimum Hole Size | 0.2mm |
| Solder Mask Thickness | 10um |
| Minimum Dielectric Thickness | 100um |
| Minimum Trace Width | 110um |
| Minimum Spacing | 110um |
| Blind Vias | Yes (L1-L2, L7-L10) |
| Buried Vias | Yes (L2-L8) |
| Via Filling | Type VII filled and capped |
2.PCB Stack-up: 10-Layer Rigid PCB (Component Side on Top)
| Material | Copper Layer | Thickness (um) | Specification |
|---|---|---|---|
| Copper | 1 | 45 | 18um base copper + 17um plating |
| IT-180 PP | Prereg | 100 | IPC-4101/24 |
| Copper | 2 | 18 | |
| IT-180 PP | Prepreg | 160 | IPC-4101/24 |
| Copper | 3 | 18 | |
| FR-4 IT-180 | Core | 200 | IPC-4101/24 |
| Copper | 4 | 18 | |
| IT-180 PP | Prepreg | 160 | IPC-4101/24 |
| Copper | 5 | 18 | |
| FR-4 IT-180 | Core | 200 | IPC-4101/24 |
| Copper | 6 | 18 | |
| IT-180 PP | Prepreg | 160 | IPC-4101/24 |
| Copper | 7 | 18 | |
| FR-4 IT-180 | Core | 100 | IPC-4101/24 |
| Copper | 8 | 18 | |
| IT-180 PP | Prepreg | 160 | IPC-4101/24 |
| Copper | 9 | 18 | |
| IT-180 PP | Prepreg | 100 | IPC-4101/24 |
| Copper | 10 | 45 | 18um base copper + 17um plating |
3. PCB Statistics
Components: 281
Total Pads: 381
Through Hole Pads: 145
Top SMT Pads: 140
Bottom SMT Pads: 96
Vias: 3051
Nets: 10
4.ARTWORK AND QUALITY
Type of Artwork Supplied: Gerber RS-274-X
Quality Standard: IPC-Class-2
Availability: Worldwide
5.Introduction to IT-180
IT-180ATC is a high Tg (175°C by DSC) multifunctional filled epoxy known for its thermal reliability and CAF resistance, suitable for various PCB applications, and can withstand lead-free assembly at 260°C.
6. Key Features of IT-180
High Tg of 175°C
Dielectric Constant: 4.4 @ 10GHz
Dissipation Factor: 0.015 @ 10GHz
Low CTE on X/Y Axis: 11-13 ppm/°C, 13-15 ppm/°C
High Thermal Reliability: T266 >60 minutes; T288, 20 minutes
Excellent CAF Resistance
Improved Z-Axis Thermal Expansion
Lead-Free
UL 94 V0 Flammability Rating
7. Typical Applications
Automotive (Engine Room ECU)
Backplanes
Data Storage
Server and Networking
Telecommunications
Power Boards
